Design Engineering Manager (m/f/d)
Onsite position – Hsinchu, Taiwan (local employment)
- Hsinchu Headquarter
- Vollzeit
- unbefristet
Große Ideen beginnen oft klein – manchmal kleiner als ein Staubkorn. Mikrochips sind die treibende Kraft hinter den Werkzeugen und Geräten, auf die wir uns täglich verlassen. Wir ermöglichen ihre Herstellung durch skalierbare, hochpräzise Lösungen in Lithografie, Wafer-Bonding und Packaging. Mit über 75 Jahren Erfahrung und weltweiter Präsenz sind wir ein vertrauenswürdiger Partner, der Verlässlichkeit und Innovationskraft verbindet.
Dabei leitet uns die Überzeugung, dass Innovation nicht nur durch Technologie entsteht, sondern durch Menschen, die Verantwortung übernehmen und gemeinsam Grenzen überwinden.
Do you have technical expertise, precision and a passion for innovation? Then join us in shaping the next technology hub in the Semiconductor Industry! In a future-orientated environment, you will develop highly complex solutions that drive progress in microelectronics. Your contribution to the continuous development and quality assurance of our products will ensure the technological breakthroughs of the next generation.
At the earliest possible date we are looking for...
Ihre Aufgaben
Design Engineering Manager TW
Tasks
- Managing and developing a team of 15 engineers with expertise in CAD, electronics and optics
- Defining and prioritising work packages
- Technical communication with customers in TW
- Communication with project managers and other stake holders in Taiwan and Germany
- Implementation and continuous optimization of engineering processes and tools
Skills
- Very good communication skills
- Good command of English
- University degree and background that match the engineering team (mechanics, electronics, optics, semiconductor, physics)
- Affinity with the semiconductor industry
- Experience in leading or coordinating engineering teams
Ihr Profil
Qualifications
- Bachelor’s or Master’s degree in Mechanical, Electrical, Mechatronic, or related Engineering discipline.
- Minimum 8 years of R&D or product development experience in semiconductor equipment, automation systems, or precision machinery.
- At least 3 years of experience leading hardware design or cross-functional engineering teams.
- Strong knowledge of mechanical and electrical system design, motion control, and vacuum/optics integration.
- Proven experience managing complex projects from concept to production release.
- Excellent leadership, problem-solving, and communication skills.
- Fluent in Mandarin; working proficiency in English preferred.
Preferred Attributes
- Experience with high-precision alignment, wafer handling, or bonding equipment.
- Familiarity with design-for-manufacturing (DFM) and design-for-assembly (DFA) principles.
- Hands-on leadership style with a strong sense of ownership and technical depth.
Characteristic
- Teamwork: Able to working in a cross function and international environment.
- Self-learning: Able to collect information to improve your knowledge pool, and also help the growth of the team by sharing knowledge.
- Proactive: Willing to tackle with technical challenges and the mindset of seeking solutions for continuous improvement.
- Planning: Result oriented thoughts for assigned task and project.
Business travel requirement
- Less than 2 month a year.
Wir bieten unter anderem
- TW_We enrich your life with attractive rewards
- TW_Working hours that accommodate your individual needs
- TW_Working together and celebrating together
- TW_Your health is important to us