Team Lead XBC300 Gen2 (m/f/d)
- Singapur
- Vollzeit
- unbefristet
Große Ideen beginnen oft klein – manchmal kleiner als ein Staubkorn. Mikrochips sind die treibende Kraft hinter den Werkzeugen und Geräten, auf die wir uns täglich verlassen. Wir ermöglichen ihre Herstellung durch skalierbare, hochpräzise Lösungen in Lithografie, Wafer-Bonding und Packaging. Mit über 75 Jahren Erfahrung und weltweiter Präsenz sind wir ein vertrauenswürdiger Partner, der Verlässlichkeit und Innovationskraft verbindet.
Dabei leitet uns die Überzeugung, dass Innovation nicht nur durch Technologie entsteht, sondern durch Menschen, die Verantwortung übernehmen und gemeinsam Grenzen überwinden.
Big ideas often start small - sometimes smaller than a speck of dust. Microchips power the tools and devices we rely on every day - from smartphones and electric vehicles to medical diagnostics and AI systems. SUSS equipment enables their production through scalable, high-precision solutions in lithography, wafer bonding, and packaging. With over 75 years of experience and a global presence, we are a trusted partner that combines reliability and innovative strength. We are guided by the conviction that innovation is not only created by technology, but by people who take responsibility and overcome boundaries together. Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies? Take responsibility for the success of our products and solutions, develop sustainable strategies and promote innovative technologies in a promising market. We are looking for the next possible date!
Ihre Aufgaben
- Lead and oversee daily shopfloor activities, ensuring clear direction and smooth operations
- Act as the first point of escalation for shopfloor-related issues
- Ensure adherence to safety standards and discipline across the shopfloor team
- Manage and support machine installation processes
- Provide preventive maintenance and troubleshooting support for equipment
- Ensure all daily documentation and operational reports are accurately completedand submitted to the management team
- Coordinate and submit parts requests to the onsite Customer Service Administrationteam
Ihr Profil
- Degree in Engineering/Science from university or technical school
- Minimum 5 years of related work experience in Advanced Packaging Engineering and Lithography, particularly in Coating process
- Strong Team Leader
- Self-driven and strong team player with keen technical ability, systematic approach, detailed-oriented, excellent problem solving skills, and positive attitude
- Ability to work independently, be hands-on and expected to dive into technical details as required to cover thinly-resourced areas
- Ability to work on a fast-paced and challenge work environment
- Good interpersonal and communication skills
Wir bieten unter anderem
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SGP_Bonus Benefits:
Year-end bonus (AWS), variable bonuses
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Gesundheitsförderung:
Unser wachsendes Gesundheitsmanagement unterstützt das Wohlbefinden unserer Mitarbeitenden durch Angebote wie Betriebsärzt:innen, Impfaktionen und falls ein, Arztbesuch nur während der Kernarbeitszeit möglich ist wird er bezahlt.
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Gemeinsam arbeiten und gemeinsam feiern:
Jubiläumsfeier, Firmenevents, Firmenläufe