Application Engineer for Bonder

Big ideas often start small - sometimes smaller than a speck of dust. Microchips power the tools and devices we rely on every day - from smartphones and electric vehicles to medical diagnostics and AI systems. SUSS equipment enables their production through scalable, high-precision solutions in lithography, wafer bonding, and packaging. With over 75 years of experience and a global presence, we are a trusted partner that combines reliability and innovative strength. 

We are guided by the conviction that innovation is not only created by technology, but by people who take responsibility and overcome boundaries together. 

Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies? Take responsibility for the success of our products and solutions, develop sustainable strategies and promote innovative technologies in a promising market.
We are looking for the next possible date

• Provide application support on SUSS MicroTec bonder tools.
• Responsible for project execution, recipe optimization, basic process training and improvement programs with the customer to effectively demonstrate the capability of new tools and/or technology.
• Supporting Product Specialist with defining process spec and ATP for customers.
• Perform final acceptance test of machines at customer site to demonstrate condition of machine and achieve final sign-off.
• Develop creative solutions to resolve customers' concerns and innovative solutions to cater to customer needs.

• Degree in Engineering/Science from a recognised university. 
• Minimum 5 years of related work experience in Lithography wafer process engineering.  
• Self-driven and strong team player with keen technical ability, systematic approach, detailed-oriented, excellent problem solving skills, and positive attitude.
• Ability to work independently, be hands-on and expected to dive into technical details as required to cover thinly-resourced areas.
• Ability to work on a fast-paced and challenge work environment.
• Good interpersonal and communication skills.
• Travel is required > 50%

• Bonus Benefits:

  Year-end bonus (AWS), variable bonuses 

• Learing, growing and celebrating together:

  Support in preparation for exams, permanent contacts, stays abroad or customer assignments, company events, running events